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SENDIXAPCB
Rigid PCB capabilities

Every limit your layout needs to respect.

Design to these values and your board will pass our DFM review first time. Search the sheet, jump to a section, or print it for your design notes.

These are the tightest values we build. Staying comfortably above them improves yield and cost. Need something outside this sheet? Ask in your quote — many limits can be extended on request.

Board specifications

Layer count, materials, dimensions, thickness, copper and finishes.

Board specifications
ParameterCapability
Layer count
  • 1 – 32 layers

1–6 layers are the fastest and most economical.

Controlled impedance
  • 4 – 32 layers
  • ±10% standard tolerance

±5% available on request.

Materials
  • FR-4 (Grade A)
  • Aluminium core (1 layer)
  • Copper core (1 layer)
  • Rogers / PTFE (2 layer)
FR-4 dielectric constant
  • Core: 4.5
  • 7628 prepreg: 4.4
  • 2116 prepreg: 4.16
  • 3313 prepreg: 4.1
Maximum board size
  • 1 layer FR-4: 606 × 510 mm
  • 2 layer FR-4: 670 × 600 mm (1020 × 600 mm extended)
  • 4 layer FR-4: 663 × 593 mm (1016 × 596 mm extended)
  • 6+ layer FR-4: 656 × 586 mm
  • Rogers / PTFE: 590 × 438 mm
  • Aluminium: 602 × 506 mm
  • Copper core: 480 × 286 mm
Minimum board size
  • FR-4, Rogers, PTFE: 3 × 3 mm
  • Castellated / plated edges: 10 × 10 mm
  • Aluminium, copper: 5 × 5 mm
Outline tolerance
  • Standard: ±0.1 mm
  • CNC routing: ±0.2 mm (±0.1 mm precision)
  • V-score: ±0.4 mm
Board thickness
  • 0.4 – 4.5 mm
  • FR-4: 0.4 / 0.6 / 0.8 / 1.0 / 1.2 / 1.6 / 2.0 mm

2.5 mm and above for 12+ layer boards only.

Thickness tolerance
  • ≥ 1.0 mm: ±10%
  • < 1.0 mm: ±0.1 mm
Outer layer copper (finished)
  • 2 layer: 1 / 2 / 2.5 / 3.5 / 4.5 oz
  • Multilayer: 1 / 2 oz
Inner layer copper (finished)
  • 0.5 oz default; 1 oz or 2 oz optional
Solder mask colours
  • Green, purple, red, yellow, blue, white, black (LPI)
Surface finish
  • HASL leaded / lead-free
  • ENIG
  • OSP

OSP is not available on single-sided FR-4, flex or aluminium boards.

Drilling

Holes, vias, slots, castellations, plated edges and backdrill.

Drilling
ParameterCapability
Drill diameter
  • 1 layer: 0.3 – 6.3 mm
  • 2 layer and multilayer: 0.15 – 6.3 mm

Holes larger than 6.3 mm are CNC routed.

Hole size tolerance
  • Plated through-hole: +0.13 / −0.08 mm
  • Press-fit: ±0.05 mm (finished 0.55 – 2.0 mm)
Hole plating thickness
  • 18 µm average
Hole position tolerance
  • ±0.05 mm
Minimum via
  • 0.15 mm hole / 0.25 mm pad
  • 1 layer (NPTH only): 0.3 mm / 0.5 mm

0.2 mm hole or larger is preferred for cost and yield.

Blind / buried vias
  • Not supported
Non-plated hole (NPTH)
  • 0.5 mm minimum
Plated slot width
  • 2 layer: 0.5 mm min.
  • Multilayer: 0.35 mm min.
Non-plated slot width
  • 1.0 mm minimum
Slot tolerance
  • Plated: +0.13 / −0.08 mm
  • Non-plated: ±0.2 mm
Hole-to-hole spacing
  • Via to via: 0.2 mm
  • Pad to pad: 0.45 mm
Castellated holes
  • Hole ≥ 0.5 mm
  • Hole to edge ≥ 1 mm
  • Hole to hole ≥ 0.5 mm
  • Board ≥ 10 × 10 mm, ≥ 0.6 mm thick
Plated edges
  • Copper-plated, ENIG finish
  • Board ≥ 10 × 10 mm, ≥ 0.6 mm thick

HASL cannot be used with plated edges.

Blind slots
  • Width ≥ 1.0 mm, depth ≥ 0.2 mm
  • Remaining thickness ≥ 0.2 mm
  • 2–32 layer FR-4, ≥ 0.8 mm thick
Backdrill
  • 4–32 layer FR-4, ≥ 0.8 mm thick
  • Through-hole 0.2 – 0.5 mm
  • Backdrill ≈ hole + 0.2 mm
  • Dielectric ≥ 0.15 mm, safety distance ≥ 0.2 mm
Rectangular holes
  • Not supported — use slots

Traces & clearances

Minimum track width and spacing by copper weight, annular rings and clearances.

Traces & clearances
ParameterCapability
Min. trace / space, 1 oz
  • 1–2 layer: 0.10 / 0.10 mm (4 / 4 mil)
  • Multilayer: 0.09 / 0.09 mm (3.5 / 3.5 mil)
Min. trace / space, 2 oz
  • 2 layer: 0.16 / 0.16 mm (6.5 / 6.5 mil)
  • Multilayer: 0.15 / 0.15 mm (6 / 6 mil)
Min. trace / space, heavy copper
  • 2.5 oz: 0.20 / 0.20 mm (8 mil)
  • 3.5 oz: 0.25 / 0.25 mm (10 mil)
  • 4.5 oz: 0.30 / 0.30 mm (12 mil)

Heavy copper is available on 2-layer boards.

Trace width tolerance
  • ±20%
PTH annular ring
  • 2 layer, 1 oz: 0.25 mm recommended (0.18 mm min.)
  • Multilayer, 1 oz: 0.20 mm recommended (0.15 mm min.)
  • 2 oz copper: 0.254 mm or more
NPTH pad annular ring
  • ≥ 0.45 mm
BGA pads
  • Pad ≥ 0.2 mm
  • Pad to trace ≥ 0.1 mm (0.09 mm multilayer)
  • Via-in-pad supported

0.20–0.25 mm BGA pads require ENIG.

Trace coils
  • Masked: 0.15 / 0.15 mm
  • Exposed: 0.25 / 0.25 mm

ENIG only; HASL risks shorts between turns.

Hatched copper grid
  • 0.25 mm width and spacing
Same-net track spacing
  • 0.25 mm
Pad to track
  • 0.1 mm
SMD pad to pad (different nets)
  • 0.15 mm
Minimum SMD pad
  • 0.25 × 0.25 mm
Via hole to track
  • 0.2 mm
PTH to track
  • 0.28 mm (0.35 mm recommended)
NPTH to track
  • 0.2 mm
Inner layer clearance
  • Via hole to copper: 0.2 mm
  • PTH hole to copper: 0.3 mm

Solder mask

Mask openings, bridges between pads, plugged vias and via-in-pad.

Solder mask
ParameterCapability
Mask expansion
  • 1:1 with pad

Keep ≥ 0.09 mm between neighbouring openings.

Minimum mask bridge
  • 1 oz, green / red / yellow / blue / purple: 0.10 mm
  • 1 oz, black / white: 0.13 mm
  • 2 oz, any colour: 0.20 mm
Plugged vias
  • Filled with solder mask
  • Via ≤ 0.5 mm
  • ≥ 0.35 mm to other openings
Via-in-pad
  • Epoxy filled and capped
  • Copper paste filled and capped
  • Via 0.15 – 0.55 mm

Default process on 6-layer and higher boards.

Mask dielectric constant
  • 3.8
Mask thickness
  • ≥ 10 µm

Silkscreen

Legend line width, text height and clearance to pads.

Silkscreen
ParameterCapability
Minimum line width
  • 0.15 mm
Minimum text height
  • 1.0 mm (40 mil)
Character width : height
  • 1 : 6
Hollow (knock-out) text ratio
  • 1 : 6
Pad to silkscreen
  • 0.15 mm

Outline & panelization

Routing, V-cut and tab-routed panels for assembly.

Outline & panelization
ParameterCapability
Routed edge
  • Min. routed slot 0.2 mm
  • Copper to edge ≥ 0.2 mm
  • Tolerance ±0.2 mm (±0.1 mm precision, boards ≥ 50 × 50 mm)

Aluminium and copper-core boards need a 1.6 mm minimum routed slot.

V-cut
  • Copper to V-cut line ≥ 0.4 mm
  • Board ≥ 0.6 mm thick
  • Panel 70 × 70 mm to 475 × 475 mm
  • 25° groove, boards ≥ 2 mm apart (3 mm recommended)
Tab routing (mouse bites)
  • Board spacing 1.6 or 2 mm
  • Holes 0.5 – 0.8 mm, 0.2 – 0.3 mm apart
  • Tab width ≥ 4 mm (5 mm with mouse bites)
  • Rails ≥ 3 mm (5 mm for SMT assembly)
Panel with spacing
  • 2 mm minimum between boards
Circular board panels
  • Each board ≥ 20 × 20 mm
Tooling holes
  • At least 3, ≥ 1.5 mm diameter

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