Every limit your layout needs to respect.
Design to these values and your board will pass our DFM review first time. Search the sheet, jump to a section, or print it for your design notes.
These are the tightest values we build. Staying comfortably above them improves yield and cost. Need something outside this sheet? Ask in your quote — many limits can be extended on request.
Board specifications
Layer count, materials, dimensions, thickness, copper and finishes.
| Parameter | Capability |
|---|---|
| Layer count |
1–6 layers are the fastest and most economical. |
| Controlled impedance |
±5% available on request. |
| Materials |
|
| FR-4 dielectric constant |
|
| Maximum board size |
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| Minimum board size |
|
| Outline tolerance |
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| Board thickness |
2.5 mm and above for 12+ layer boards only. |
| Thickness tolerance |
|
| Outer layer copper (finished) |
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| Inner layer copper (finished) |
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| Solder mask colours |
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| Surface finish |
OSP is not available on single-sided FR-4, flex or aluminium boards. |
Drilling
Holes, vias, slots, castellations, plated edges and backdrill.
| Parameter | Capability |
|---|---|
| Drill diameter |
Holes larger than 6.3 mm are CNC routed. |
| Hole size tolerance |
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| Hole plating thickness |
|
| Hole position tolerance |
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| Minimum via |
0.2 mm hole or larger is preferred for cost and yield. |
| Blind / buried vias |
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| Non-plated hole (NPTH) |
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| Plated slot width |
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| Non-plated slot width |
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| Slot tolerance |
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| Hole-to-hole spacing |
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| Castellated holes |
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| Plated edges |
HASL cannot be used with plated edges. |
| Blind slots |
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| Backdrill |
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| Rectangular holes |
|
Traces & clearances
Minimum track width and spacing by copper weight, annular rings and clearances.
| Parameter | Capability |
|---|---|
| Min. trace / space, 1 oz |
|
| Min. trace / space, 2 oz |
|
| Min. trace / space, heavy copper |
Heavy copper is available on 2-layer boards. |
| Trace width tolerance |
|
| PTH annular ring |
|
| NPTH pad annular ring |
|
| BGA pads |
0.20–0.25 mm BGA pads require ENIG. |
| Trace coils |
ENIG only; HASL risks shorts between turns. |
| Hatched copper grid |
|
| Same-net track spacing |
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| Pad to track |
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| SMD pad to pad (different nets) |
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| Minimum SMD pad |
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| Via hole to track |
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| PTH to track |
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| NPTH to track |
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| Inner layer clearance |
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Solder mask
Mask openings, bridges between pads, plugged vias and via-in-pad.
| Parameter | Capability |
|---|---|
| Mask expansion |
Keep ≥ 0.09 mm between neighbouring openings. |
| Minimum mask bridge |
|
| Plugged vias |
|
| Via-in-pad |
Default process on 6-layer and higher boards. |
| Mask dielectric constant |
|
| Mask thickness |
|
Silkscreen
Legend line width, text height and clearance to pads.
| Parameter | Capability |
|---|---|
| Minimum line width |
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| Minimum text height |
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| Character width : height |
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| Hollow (knock-out) text ratio |
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| Pad to silkscreen |
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Outline & panelization
Routing, V-cut and tab-routed panels for assembly.
| Parameter | Capability |
|---|---|
| Routed edge |
Aluminium and copper-core boards need a 1.6 mm minimum routed slot. |
| V-cut |
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| Tab routing (mouse bites) |
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| Panel with spacing |
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| Circular board panels |
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| Tooling holes |
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